may 2011 doc id 17262 rev 1 1/7 7 STPS2045C-Y automotive power schottky rectifier features very small conduction losses negligible switching losses extremely fast switching avalanche rated aec-q101 qualified description dual center tap schottky rectifier suited for high frequency dc to dc converters. packaged in d 2 pak, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. table 1. device summary i f(av) 2 x 10 a v rrm 45 v t j(max) 175 c v f(typ) 0.57 v d 2 pak stps2045cgy a1 a2 k k a1 a2 www.st.com
characteristics STPS2045C-Y 2/7 doc id 17262 rev 1 1 characteristics when the diodes 1 and 2 are used simultaneously : t j (diode 1) = p(diode 1) x r th(j-c) (per diode) + p(diode 2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.42 x i f(av) + 0.015 i f 2 (rms) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) forward rms current 30 a i f(av) average forward current = 0.5 t c = 155 c per diode 10 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 180 a p arm repetitive peak avalanche power t p = 1 s, t j = 25 c 4000 w t stg storage temperature range -65 to +175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal r unaway for a diode on its own heatsink -40 to +175 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistances parameters symbol parameter value unit r th(j-c) junction to case per diode to t a l 2.2 1.3 c/w r th(c) coupling 0.3 c/w table 4. static electrical characteristics (per diode) symbol test conditions min. typ. max. unit i r (1) 1. pulse test : t p = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm --100 a t j = 125 c - 7 15 ma v f (1) forward voltage drop t j = 125 c i f = 10 a - 0.5 0.57 v t j = 25 c i f = 20 a - - 0.84 t j = 125 c - 0.65 0.72 dptot dtj < 1 rth(j-a)
STPS2045C-Y characteristics doc id 17262 rev 1 3/7 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) 0 1 2 3 4 5 6 7 8 9 10 11 12 0 1 2 3 4 5 6 7 8 p (w) f(av) i (a) f(av) t =tp/t tp = 1 = 0.5 = 0.2 = 0.1 = 0.05 i (a) f(av) 0 25 50 75 100 125 150 175 0 2 4 6 8 10 12 t (c) amb t =tp/t tp r=r th(j-a) th(j-c) r =15c/w th(j-a) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 6. relative variation of thermal impedance junction to ambient versus pulse duration 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 140 i (a) m t =100c c t =125c c t =75c c t(s) i m t =0.5 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 single pulse = 0.1 = 0.2 = 0.5 t (s) p z/r th(j-c) th(j-c) t =tp/t tp
characteristics STPS2045C-Y 4/7 doc id 17262 rev 1 figure 7. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 8. junction capacitance versus reverse voltage applied (typical values, per diode) 0 5 10 15 20 25 30 35 40 45 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 5e+4 i (a) r v (v) r t =150c j t =125c j t =100c j t =75c j t =50c j t =25c j 12 51020 50 100 200 500 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j figure 9. forward voltage drop versus forward current (maximum values, per diode) figure 10. thermal resistance junction to ambient versus copper surface under tab 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1.0 10.0 100.0 i (a) fm t =125c (typical values) j t =125c j t =25c j v (v) fm 0 5 10 15 20 25 30 35 40 0 10 20 30 40 50 60 70 80 s(cm2) r (c/w) th(j-a) (epoxy printed circuit board, copper thickness: 35 m)
STPS2045C-Y package information doc id 17262 rev 1 5/7 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint (dimensions in mm) table 5. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
ordering information STPS2045C-Y 6/7 doc id 17262 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps2045cgy-tr stps2045cgy d 2 pak 1.48 g 1000 tape and reel table 7. document revision history date revision changes 24-may-2011 1 initial release.
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